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Gold Plating
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Electric Gold Plating
Gold Strike Plating Bath
| Product | Crystal purity (%) | Concentration (g/L) | Precipitation Speed (㎛) | pH | Temperature (℃) | Current density (A/d㎡) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|---|
| GC-ST | 99.7 | 2 | flash | below 1 | 25~35 | 2 (1~5) | 100~120 | It makes adhesion be good in plating on stainless steel directly and endows high corrosion resistance |
Hard Gold Plating Bath
| Product | Alloy | Crystal purity (%) | Concentration (g/L) | Precipitation Speed (㎛/min) | pH | Temperature (℃) | Current density (A/d㎡) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|---|---|
| GC-700 | Co | 99.7 | 4 (1~8) | 0.2~1.5 | 3.8 (3.5~4.2) | 45 | 0.2~1.5 | 160 | It has excellent Color and hardness which is appropriate in contactor, electric contact, terminal plating and Rack plating or Barrel plating |
| GCI-700 | Co,In | 92.0 | 4 (1~8) | 0.2~1.5 | 3.8 (3.5~4.0) | 30 | 0.2~1.5 | 180 | |
| GN-700 | Ni | 99.7 | 4 (1~8) | 0.2~1.5 | 3.8 (3.5~4.2) | 45 | 0.2~1.5 | 160 | |
| GNI-700 | Ni,In | 92.0 | 4 (1~8) | 0.2~1.5 | 3.8 (3.5~4.0) | 30 | 0.2~1.5 | 180 |
High Speed Gold Plating Bath - Reel To Reel
| Product | Alloy | Crystal purity (%) | Concentration (g/L) | Precipitation Speed (㎛/min) | pH | Temperature (℃) | Current density (A/d㎡) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|---|---|
| HGP-C | Co | 99.7 | 10 | 1~8 | 4.0 (3.5~4.5) | 55 | 1~30 | 140 | It has excellent Color and hardness which is appropriate in contactor and terminal plating, PCB plating and it is the appropriate product in high speed plating generally |
| HGP-N | Ni | 99.8 | 10 | 1~8 | 4.0 (3.5~4.5) | 55 | 1~30 | 140 |
Gold-Tin Alloy Plating Bath
| Product | Alloy | Crystal purity (%) | Concentration (g/L) | Precipitation Speed (㎛/min) | pH | Temperature (℃) | Current density (A/d㎡) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|---|---|
| GTP-750 | Sn | Au:70~80 Sn:20~30 | 6 (5~8) | 0.3 | 4.7 (4.5~5.0) | 65 | 0.5 | 300 | It is Semi-Bright Plating Bath of Tin Alloy(20~30%) and appropriate product for use of connection in 280±10℃ |
Pure Gold Plating Bath
| Product | Crystal purity (%) | Concentration (g/L) | Precipitation Speed (㎛/min) | pH | Temperature (℃) | Current density (A/d㎡) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|---|
| SOFA-100 | 99.9 | 8 | 0.15 | 6.0 (5.8~6.2) | 65 (60~70) | 0.5 (0.1~1.0) | 80 | As subacidity plating solution, we can get smooth and matt plating matter and it is the appropriate product in wire bonding as semiconductor, lead frame |
Electroless Gold Plating
Immersion Electroless Gold Plating Bath
| Product | Crystal purity (%) | Concentration (g/L) | Precipitation velocity | pH | Temperature (℃) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|
| KNE-GOLD 9000A | 99.9 | 2 (0.5~5.0) | 0.08~0.1㎛ / 10min | 4.5~5.3 | 85~90 | 85~90 | As using a principle of electrochemical ionized tendency, we can get extracted gold simply and adhesion is excellent and it is the appropriate product in electronic component, PCB, the fixed parts plating |
Immersion Electroless Thicker Gold Plating Bath
| Product | Crystal purity (%) | Concentration (g/L) | Precipitation velocity (㎛/min) | pH | Temperature (℃) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|
| KNE-GOLD 9002A | 99.9 | 4 | 0.5~0.7㎛ /20min | 4.6 | 85~88 | 60~80 | It is the available for making plating thickness maximum 0.8㎛ and product in electronic component, PCB, the fixed parts plating |
Electroless Gold Plating Bath
| Product | Crystal purity (%) | Concentration (g/L) | Precipitation velocity | pH | Temperature (℃) | Hardness (Hv0.025) | Characteristics of product and Applying Fiend |
|---|---|---|---|---|---|---|---|
| KNE-GOLD 9001A | 99.9 | 3 | 4~6 ㎛/hr | 13.7 | 70±5 | 60~80 | It is the appropriate product for bonding of electronic component and soldering as electroless gold plating by returning as autocatalytic |